This inventor holds 2 USPTO granted patents. Top assignees: Commissariat a L'energie Atomique Et Aux Energies Alternatives, Stmicroelectronics (Crolles 2) Sas. Active years: 2017-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
2 out of 8,819 
2 out of 778 
Years Active: 2017-2018
Title: Viorel Balan: Innovator in Substrate Bonding Technologies
Introduction
Viorel Balan is a notable inventor based in La Buisse, France. He has made significant contributions to the field of substrate bonding technologies, holding a total of 2 patents. His work focuses on innovative methods that enhance the efficiency and effectiveness of substrate bonding processes.
Latest Patents
Balan's latest patents include two groundbreaking inventions. The first patent, titled "Plurality of substrates bonded by direct bonding of copper recesses," describes a structure that features a substrate with an upper surface containing recesses. This substrate is coated with a continuous barrier layer and topped with a continuous copper layer that fills the recesses. The structure undergoes a chemical-mechanical polishing process that selectively polishes the copper, ensuring that it remains in the recesses and is coplanar with the substrate's upper surface. The invention allows for two such structures to be directly bonded to each other with copper-to-copper connections.
The second patent, "Method of planarizing recesses filled with copper," outlines a similar structure. It involves a substrate with recesses coated with a barrier layer and a copper layer. The planarization process includes selective chemical-mechanical polishing, followed by the deposition of a material that covers the copper at the recesses. This method allows for the copper to remain buried under the material while exposing the substrate. The two structures can then be bonded together with matching topologies.
Career Highlights
Throughout his career, Viorel Balan has worked with prominent organizations, including the Commissariat à l'Énergie Atomique et aux Énergies Alternatives and STMicroelectronics (Crolles 2) SAS. His experience in these companies has contributed to his expertise in substrate bonding technologies and innovation.
Collaborations
Balan has collaborated with various professionals in his field, including his coworker Maurice Rivoire. These collaborations have further enriched his work and contributed to the advancement of substrate bonding technologies.
Conclusion
Viorel Balan is a distinguished inventor whose work in substrate bonding technologies has led to significant advancements in the field. His innovative patents and career experiences reflect his commitment to enhancing the efficiency of bonding processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile