Vincent K Chan

Title: The Innovative Contributions of Vincent K Chan

Introduction

Vincent K Chan is a notable inventor based in Richmond Hill, Canada, with a remarkable portfolio of 12 patents. His work primarily focuses on advancements in semiconductor technology and integrated circuit packaging. Chan's innovative contributions have significantly impacted the electronics industry.

Latest Patents

One of Chan's latest patents is the "Integrated circuit package strip with stiffener." This invention employs a stiffener layer that houses a passive electronic component, maintaining mechanical properties when a thinner substrate is used. The design allows for the manufacture of integrated circuit packages using strip, matrix, or array technology, enabling industrial production of larger boards that can be cut into individual units. Another significant patent is the "Flip chip semiconductor assembly with variable volume solder bumps." This method involves attaching a semiconductor chip to a substrate, forming conductive column bumps of differing volumes, and ensuring robust electrical and mechanical connections between the die pads and substrate pads.

Career Highlights

Throughout his career, Vincent K Chan has worked with prominent companies such as ATI Technologies ULC and ATI Technologies Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor field.

Collaborations

Chan has collaborated with notable professionals in the industry, including Roden R Topacio and Neil McLellan. These partnerships have fostered an environment of innovation and creativity, leading to the development of advanced technologies.

Conclusion

Vincent K Chan's contributions to the field of semiconductor technology and integrated circuit packaging are noteworthy. His innovative patents and collaborations have made a significant impact on the industry, showcasing his expertise and dedication to advancing technology.