The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Nov. 20, 2000
Vincent K. Chan, Richmond Hill, CA;
Samuel W. Ho, Toronto, CA;
Vincent K. Chan, Richmond Hill, CA;
Samuel W. Ho, Toronto, CA;
ATI Technologies, Inc., Thornhill, CA;
Abstract
An integrated circuit package includes a first or active substrate and a second or passive substrate. The active substrate includes at least one circuit that generates heat during circuit operation. The passive substrate does not include any heat-generating circuits, although the passive substrate may include passive, disabled or dormant circuitry. The two substrates are preferably fabricated of semiconductor material and have substantially equal coefficients of thermal expansion. The passive substrate is thermally coupled to the active substrate preferably using a thin layer of adhesive, such as an epoxy. The passive substrate serves to thermally conduct the heat generated by the circuits of the active substrate away from the active substrate. An internal metallic heat sink may be optionally thermally coupled to the passive substrate to further aid in the transfer of heat away from the active substrate.