Toronto, Canada

Samuel Ho


 

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 41(Granted Patents)


Company Filing History:


Years Active: 2005-2007

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3 patents (USPTO):Explore Patents

Title: Innovations by Samuel Ho

Introduction

Samuel Ho is a notable inventor based in Toronto, Canada. He has made significant contributions to the field of technology, particularly in the development of multi-die modules. With a total of three patents to his name, his work has garnered attention in the industry.

Latest Patents

Samuel Ho's latest patents include innovative designs for multi-die modules. One of his patents describes a multi-die module that is electrically connected to both an unpackaged die and a packaged die. This module has a footprint that matches conventional multi-die packages, allowing it to be interchangeable with them. In one embodiment, the unpackaged die is a graphics processor, while the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.

Career Highlights

Samuel Ho is currently employed at ATI Technologies Inc., where he continues to push the boundaries of technology. His work has been instrumental in advancing the capabilities of multi-die modules, making them more efficient and versatile.

Collaborations

Some of his coworkers include Vincent K Chan and Vincent Chan, who have likely contributed to his innovative projects and ideas.

Conclusion

Samuel Ho's contributions to the field of technology through his patents and work at ATI Technologies Inc. highlight his role as a significant inventor in the industry. His innovations in multi-die modules are paving the way for future advancements in technology.

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