Victor Tan Cher ′Khng

Title: Victor Tan Cher ′Khng: Innovator in Semiconductor Packaging

Introduction

Victor Tan Cher ′Khng is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. He has developed innovative methods that enhance the efficiency and reliability of semiconductor devices. His work is particularly significant in the context of modern electronics, where miniaturization and performance are paramount.

Latest Patents

Victor holds a patent for a "Method for fabricating semiconductor package with multi-layer die contact and external contact." This invention describes a semiconductor package that includes a substrate made of board material, a semiconductor die bonded to the substrate, and an encapsulant covering the die. The package features an array of external contacts formed as multi-layered metal bumps, which are smaller and more uniform than traditional solder balls. This design allows for low-temperature deposition processes, reducing package warpage. The external contacts can be shaped through etching to create generally planar tip portions, facilitating bonding to the electrodes of a supporting substrate. Additionally, die contacts on the substrate can also be formed as multi-layered metal bumps, enabling flip chip mounting. The fabrication method involves depositing different layers for the metal bumps using electroless and electrolytic deposition, followed by etching to shape the bumps.

Career Highlights

Victor is currently employed at Micron Technology Incorporated, where he continues to push the boundaries of semiconductor technology. His work has contributed to advancements in the efficiency and performance of semiconductor packages, making a significant impact in the industry.

Collaborations

Victor collaborates with Lee Kian Chai, working together to innovate and improve semiconductor packaging solutions. Their partnership exemplifies the importance of teamwork in driving technological advancements.

Conclusion

Victor Tan Cher ′Khng is a prominent figure in the semiconductor industry, with a focus on innovative packaging methods that enhance device performance. His contributions are vital to the ongoing evolution of electronics, ensuring that technology continues to advance.