Victor Tan Cher 'Khng

Title: Victor Tan Cher 'Khng: Innovator in Semiconductor Packaging

Introduction

Victor Tan Cher 'Khng is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative approaches have led to advancements in the efficiency and reliability of semiconductor devices.

Latest Patents

Victor's latest patents include a method for fabricating semiconductor packages with multi-layer metal bumps. This semiconductor package features a substrate made of board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package incorporates an array of external contacts formed as multi-layered metal bumps, which consist of a base layer, a bump layer, and a non-oxidizing outer layer. These external contacts are smaller and more uniform than conventional solder balls, allowing for fabrication using low-temperature deposition processes that reduce package warpage. Additionally, the external contacts can be shaped by etching to have generally planar tip portions, facilitating bonding to electrodes of a supporting substrate. The die contacts on the substrate can also be formed as multi-layered metal bumps, enabling flip chip mounting to the substrate. The method for fabricating the package includes depositing the different layers for the metal bumps using electroless and electrolytic deposition, followed by etching to shape the metal bumps.

Another significant patent by Victor is for a semiconductor package with wire bonded stacked dice and multi-layer metal bumps. This package shares similar features with his previous patent, including the use of a substrate, semiconductor die, and encapsulant. The external contacts are again formed as multi-layered metal bumps, which enhance the performance and reliability of the semiconductor package.

Career Highlights

Victor Tan Cher 'Khng is currently employed at Micron Technology Incorporated, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced packaging solutions that meet the growing demands of modern electronics.

Collaborations

Victor collaborates with his coworker, Lee Kian Chai, to further enhance the research and development efforts at Micron Technology Incorporated.

Conclusion

Victor Tan Cher 'Khng is a prominent inventor whose work in semiconductor packaging has led to significant advancements in the field. His innovative patents reflect his commitment to improving technology and enhancing the performance of electronic devices.