Company Filing History:
Years Active: 2023
Title: Victor J. Prokoff: Innovator in High-Frequency Interconnect Technology
Introduction
Victor J. Prokoff is an esteemed inventor based in Portland, Oregon, recognized for his significant contributions to the field of microelectronics. With a focus on high-frequency interconnect technology, Prokoff has made advancements that enhance communication between microelectronic components, specifically through his innovative patent.
Latest Patents
Victor J. Prokoff holds a patent for a "Contactless High-Frequency Interconnect." This invention relates to a multi-chip microelectronic package that comprises a first die and a second die connected to a package substrate. The unique feature of this technology involves the respective radiative elements of both dies, which are communicatively coupled to enable communication via an electromagnetic signal at frequencies of approximately 20 gigahertz (GHz) or higher. This advancement holds promise for improving the efficiency and performance of microelectronic devices.
Career Highlights
Currently, Victor Prokoff is a part of Intel Corporation, a leading company in technological advancements and semiconductor manufacturing. His role at Intel has allowed him to collaborate on innovative projects that push the boundaries of microelectronic technology. With one patent to his name, Prokoff has established himself as a notable contributor to the field.
Collaborations
Throughout his career, Victor has had the opportunity to collaborate with talented individuals, including Henning Braunisch and Adel A. Elsherbini. These collaborations have facilitated the exchange of ideas and fostered innovation, leading to advancements in microelectronics and interconnect technologies.
Conclusion
Victor J. Prokoff’s contributions to high-frequency interconnect technology exemplify the spirit of innovation that drives progress in the microelectronics sector. As he continues his work at Intel Corporation, his patent on contactless interconnects stands as a testament to his dedication and expertise in advancing the capabilities of microelectronic packaging.