Intel Corporation

Victor J Prokoff

Johanna M Swan

Adel A Elsherbini

Telesphor Kamgaing

Georgios C Dogiamis

Henning Braunisch

Richard J Dischler

Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

Growing community of inventors

Portland, OR, United States of America

Victor J Prokoff