Victor H Okumoto

Title: Victor H Okumoto: Innovator in Integrated Circuit Technology

Introduction

Victor H Okumoto is a notable inventor based in San Francisco, CA. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique method for forming conductive bumps on integrated circuit dies.

Latest Patents

Victor H Okumoto holds a patent for a "Structure for holding integrated circuit dies to be electroplated." This patent describes a method of forming conductive bumps on the bond pads of one or more integrated circuits (ICs). The process involves forming a barrier metal layer, such as TiW, over the bond pads to passivate the surface of the ICs. An electroplatable base comprising an adhesion metal layer is then formed over each bond pad using a contact metal mask. Finally, a conductive bump is created on top of the electroplatable base through electroplating or electroless bath techniques. The patent also details a structure for holding multiple good IC dies while conductive bumps are being electroplated on their bond pads.

Career Highlights

Victor H Okumoto is associated with VLSI Technology, Inc., where he has contributed to advancements in semiconductor technology. His work has been instrumental in enhancing the reliability and performance of integrated circuits.

Collaborations

Victor has collaborated with various professionals in the field, including his coworker, Francisca Tung. Their combined expertise has fostered innovation and development in integrated circuit technologies.

Conclusion

Victor H Okumoto's contributions to integrated circuit technology through his patent and work at VLSI Technology, Inc. highlight his role as a significant innovator in the field. His advancements continue to influence the development of semiconductor technologies.