Company Filing History:
Years Active: 2007-2011
Title: Victor Allison: Innovator in Stackable Electronic Assembly
Introduction
Victor Allison is a notable inventor based in Huntington, Texas. He has made significant contributions to the field of electronics, particularly in the development of stackable chip-scale packages. With a total of two patents to his name, Allison's work focuses on improving memory density and heat dissipation in electronic assemblies.
Latest Patents
Allison's latest patent, titled "Stackable Electronic Assembly," introduces a stackable chip-scale package designed to enhance memory density. This innovative design allows for mounting within limited areas or modules. A novel staggered routing scheme is employed, enabling the same trace routing at every level of the stacked architecture. This approach facilitates efficient access to individual memory devices within the chip-scale package stack. The use of a ball grid array chip-scale package architecture, combined with thermally compatible materials, reduces the risk of thermal cracking while improving heat dissipation. Additionally, this architecture allows for the mounting of support components, such as capacitors and resistors, directly on the chip-scale package.
Career Highlights
Victor Allison is currently associated with Sanmina-SCI Corporation, where he continues to innovate in the field of electronics. His work has garnered attention for its practical applications and contributions to technology.
Collaborations
Allison has collaborated with notable colleagues, including Mark Ellsberry and Charles E. Schmitz, who have contributed to his projects and innovations.
Conclusion
Victor Allison's contributions to the field of electronics, particularly through his patents on stackable electronic assemblies, highlight his role as an influential inventor. His work not only improves memory density but also enhances the overall efficiency of electronic devices.