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For the Inventor, By the Inventor

Sunnyvale, CA, United States of America

Vic Hong Chia

This inventor holds 38 USPTO granted patents and 9 published patent applications and 1 EPO patent, primarily in Thermal Management. Top assignee: Cisco Technology, Inc.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vic Hong Chia. Retrieved from https://idiyas.com/inventor/vic-hong-chia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 

% Patents Active = 89.5

 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 71(Granted Patents)


Company Filing History:

goldMedal38 out of 21,378 
 
Cisco Technology, Inc.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Bi-Directional Airflow
Thermal Interface Material
Cooling Solutions
High Impact Resistant Heat Sink
Airflow Control
Modular Electronic Systems
Heat Spreader
Electromagnetic Compatibility
Cooling Fan Assembly
Vapor Chamber
Dynamic Air Baffle
Removable Module Adapter
38 patents (USPTO):Explore Patents
1. 12729888 - Coolant refresh device for coolant distribution unit (2026-09-08),
2. 12685167 - Heatsink for ring type integrated circuits (2026-07-14),
3. 12607203 - Configurable bi-directional airflow fan (2026-04-21),
4. 12474725 - On-demand flow rate adapter for flow rate adjustment in liquid cooling solutions (2025-11-18),
5. 12435736 - Fan guard for fan (2025-10-07),
6. 12213276 - Intelligent dynamic air baffle (2025-01-28),
7. 12209596 - Configurable bi-directional airflow fan (2025-01-28),
8. 12207435 - Cooling fan assembly with air guider (2025-01-21),
9. 12167567 - Fan silencer module (2024-12-10),
10. 12160979 - Compressible thermal link (2024-12-03),
11. 12156324 - Thermal Interface Material (TIM) filling structure for high warpage chips (2024-11-26),
12. 12075588 - Ejector for field replaceable module (2024-08-27),
13. 12022639 - Induced air convection cooling for computing or networking devices (2024-06-25),
14. 11778771 - Airflow control louver for bidirectional airflow cooling (2023-10-03),
15. 11778725 - Thermal interface material (TIM) filling structure for high warpage chips (2023-10-03),

Title: Inventor Vic Hong Chia

Introduction: Vic Hong Chia is a talented inventor based in Sunnyvale, CA, known for his innovative contributions in various fields.

Latest Patents: Vic Hong Chia holds several patents in the areas of technology and consumer electronics, showcasing his expertise and creativity.

Career Highlights: Throughout his career, Vic Hong Chia has been recognized for his groundbreaking inventions that have significantly impacted the industry. His dedication to pushing the boundaries of innovation is truly commendable.

Collaborations: Vic Hong Chia has collaborated with leading tech companies and research institutions to bring his ideas to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: In conclusion, Vic Hong Chia is a visionary inventor whose passion for innovation continues to inspire others in the field. His remarkable contributions have solidified his reputation as a prominent figure in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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