Cisco Technology, Inc.

Vic Hong Chia

Hong Huynh

Yongguo Chen

Hua Yang

Yaotsan Tsai

Chejung Liu

George Edward Curtis

Robert Gregory Twiss

Mandy Hin Lam

Steven Alf Hanssen

M Baris Dogruoz

Keith Frank Tharp

Edward John Kliewer

Frank S Jun

Xin Mao

Ravinandana Mysore Ramachandra Rao

John David Stallings

Phil Slight

Alpesh Umakant Bhobe

Wei Qi

Amrik Singh Bains

Phillip S Ting

Joseph Jacques

Long Dang

Khanh Tieu Ly

Adriana Del Pilar Rangel

M Onder Cap

Perry L Hayden

John Scott Scheeler

Minawati

Zahid Naveed Aziz

Peter Christopher McLean

Harvey Yang

Baris Dogruoz

Zefeng Zhang

Paul Matthew Plummer

Yong Hong Luo

Long Huu Dang

A flow rate adapter includes an enclosure defining an interior, a first partition separating the interior into first and second chambers, a second partition separating the interior into third and fourth chambers, and a flexible diaphragm separating the second and third chambers. Each chamber is fluidly isolated from one another. The second and third chambers are positioned between the first and fourth chambers with the second chamber being positioned adjacent to the first chamber and the third chamber being positioned adjacent to the fourth chamber. The second and third chambers are positioned adjacent to one another. The flow rate adapter includes a gate coupled with the flexible diaphragm. A temperature gradient between working fluid flowing through the first and fourth chambers causes the flexible diaphragm to flex, which moves the gate within the fourth chamber to control the flow rate of the working fluid.

On-demand flow rate adapter for flow rate adjustment in liquid cooling solutions

A fan guard that includes an array of openings disposed adjacent to one another along a plane to enable flow of air directed transverse to the plane, segments that each include a face extending along the plane and a thickness extending transverse to the plane, and flanges connected to the segments to cooperatively form the array of openings. Each flange includes a depth extending transverse to the plane, the depth being greater than the thickness of each segment of the plurality of segments.

Fan guard for fan

Various devices, systems, and methods are described herein that provide bi-directional, and even multi-directional airflow within fan systems. These fan systems can be utilized by devices such as datacenter switches to change from one direction of airflow (such as port side inlet) to another direction (such as port side exhaust). This can be done manually by having a multi-directional fan housed within an enclosure that provides access through a hatch door. The multi-directional fan can be removed and reoriented to a second direction, thus providing airflow with the same quality and pressure in multiple directions. Fan changes can also be automated through one or more interlocking rotational gears coupled to the fans within a housing, such that rotating one gear will rotate each of the fans within the housing, thus changing the direction of the airflow. By doing this, only one fan is needed to provide airflow in multiple directions.

Configurable bi-directional airflow fan

A dynamic air baffle comprises: spaced-apart first and second plates configured to be positioned adjacent to at least one heat source to be cooled by an airflow; a heat insulator sandwiched between the first and second plates; and an air flap coupled to the first and second plates and extending into the airflow; wherein the first and second plates are configured such that a differential temperature between the first and second plates causes a differential expansion in lengths of the first and second plates, which rotates the air flap from a rest position, corresponding to when the differential temperature is zero, to a rotated position that is closer to a cooler plate and farther from a hotter plate of the first and second plates, such that the air flap directs more of the airflow to the hotter plate and less of the airflow to the cooler plate.

Intelligent dynamic air baffle

A fan assembly comprises: a fan having a fan intake and a fan exit downstream from the fan intake, wherein the fan is configured to draw air into the fan intake and propel the air downstream through the fan exit; a housing having a housing inlet coupled to the fan exit and a housing outlet downstream from the housing inlet; and an air guider, mounted inside the housing adjacent to the housing inlet, having a conical shape with a base adjacent to the housing inlet and an apex opposite the base that points towards the housing outlet, wherein the air guider has a first diameter that tapers from the base to the apex, and wherein the air guider is configured to reduce air turbulence of the air when the air is propelled from the housing inlet to the housing outlet.

Cooling fan assembly with air guider

A fan silencer module includes a housing having a first end of the housing, a second end of the housing, and an interior surface between the first end of the housing and the second end of the housing. Acoustic absorbing material is disposed on the interior surface. A honeycomb air flow director is disposed at the second end of the housing. And an electromagnetic interference gasket surrounds an outer edge of the honeycomb air flow director. In an embodiment, a depth of the electromagnetic interference gasket is at least as deep as a depth of the honeycomb air flow director. Also provided is a handle, and a latch actuator, to enable removal and replacement of the fan silencer module and an associated fan module from a chassis.

Fan silencer module

According to one embodiment, an apparatus is provided that includes a first block and a second block, one or more springs provided between the first block and the second block, and a thermally conductive wrap extending from the first block to the second block, wherein the thermally conductive wrap is configured to conduct heat away from the first block. An assembly including a chassis, a receptacle, and the apparatus is also provided, as well as a method for operating the apparatus.

Compressible thermal link

A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.

Thermal Interface Material (TIM) filling structure for high warpage chips

An ejector may be provided. The ejector may comprise a pawl, a trigger, and a handle. The pawl may be configured to rotate relative to a line card about a first axis. The pawl may comprise a pawl concavity. The trigger may be configured to rotate relative to the line card about a second axis. The trigger may comprise a trigger catch and a trigger lever. The trigger catch may be configured to engage the pawl concavity. The handle may be connected to the pawl and configured to rotate relative to the pawl about a third axis. The trigger catch may be configured to engage the pawl concavity to inhibit rotation of the pawl about the first axis. The trigger catch may be configured to disengage the pawl concavity and to allow rotation of the pawl about the first axis.

Ejector for field replaceable module

An apparatus comprising a printed circuit board with at least one heat source, an enclosure around the printed circuit board, wherein the enclosure includes a first surface and a second surface opposite the first surface, and a heatsink comprising a body portion and a plurality of fins extending from the body portion, wherein the heatsink is attached to the first surface, and wherein the at least one heat source conducts heat to the heatsink, wherein a plurality of channels are provided between the first surface and the second surface, each of the plurality of channel passing through the enclosure, the heatsink, and the printed circuit board.

Induced air convection cooling for computing or networking devices

Embodiments for providing cooling airflow through electronic in two different directions is described. An airflow control louver system in an electronic device provides for cooling airflow to be efficiently routed through the electronic device in the two different directions which in turn allows for multiple installation configurations for electronic devices with high powered heat sensitive components.

Airflow control louver for bidirectional airflow cooling

Thermal interface material (TIM) filling structure for high warpage chips

Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.

Vapor chamber embedded remote heatsink

A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.

Electromagnetic compatibility gasket and vent

A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.

Growing community of inventors

Sunnyvale, CA, United States of America

Vic Hong Chia