This inventor holds 1 USPTO granted patent. Top assignee: Rohm and Haas Electronic Materials Cmp Holdings, Inc.. Active years: 2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024
Title: Vere O Archibald: Innovator in Chemical Mechanical Polishing Technology
Introduction
Vere O Archibald is a notable inventor based in North Wales, PA (US). He has made significant contributions to the field of chemical mechanical polishing (CMP) technology. His innovative work has led to the development of advanced polishing pads that enhance the efficiency and effectiveness of CMP processes.
Latest Patents
Vere O Archibald holds a patent for "Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith." This invention provides CMP polishing pads or layers with a Shore DO (15 second) hardness ranging from 40 to 80. The pads are made from a two-component reaction mixture that includes a liquid aromatic isocyanate component and a liquid polyol component. The formulation is designed to reduce the density of the CMP polishing pad to between 0.2 to 0.50 g/mL, ensuring optimal performance in CMP applications.
Career Highlights
Vere O Archibald is associated with Rohm and Haas Electronic Materials CMP Holdings, Inc. His work at this company has been instrumental in advancing CMP technologies. He has focused on creating high-performance materials that meet the demanding requirements of the semiconductor industry.
Collaborations
Throughout his career, Vere has collaborated with several professionals, including Michael E Mills and Annette M Crevasse. These collaborations have contributed to the development of innovative solutions in the field of chemical mechanical polishing.
Conclusion
Vere O Archibald's contributions to CMP technology through his patented innovations have significantly impacted the industry. His work continues to influence the development of high-performance materials for semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
