Venita L Dyer

Title: Innovations by Venita L Dyer

Introduction

Venita L Dyer is a notable inventor based in Sherman Oaks, CA (US). She has made significant contributions to the field of microelectronics, particularly through her innovative patents. With a total of 2 patents, her work focuses on advanced methods for fabricating sealed microelectronic packages.

Latest Patents

Dyer's latest patents include "Hydrogen getters and methods for fabricating sealed microelectronic packages employing same" and "Sealing electronic packages containing bumped hybrids." The first patent describes a hydrogen getter that comprises a thin film with a layer of inert material and a hydrogen reactive material. This innovative approach utilizes palladium oxide powder and epoxy resin to enhance the efficiency of hydrogen getters. The second patent outlines a method for packaging hybrid wafers or die interconnected using soft metal bumps, such as indium, in a sealed ceramic package. This method ensures that the metal in the bumps does not wet the surface of the hybrid die during high-temperature sealing.

Career Highlights

Throughout her career, Venita has worked with prominent companies, including Raytheon Company. Her expertise in microelectronics has led to advancements in the packaging and sealing of electronic components, making her a valuable asset in the industry.

Collaborations

Dyer has collaborated with notable individuals such as O Glenn Ramer and Thomas K Dougherty. These partnerships have contributed to her innovative work and the successful development of her patents.

Conclusion

Venita L Dyer's contributions to microelectronics through her patents demonstrate her expertise and innovative spirit. Her work continues to influence the field, paving the way for future advancements in technology.