Other

Raytheon Company

Venita L Dyer

O Glenn Ramer

Thomas K Dougherty

John J Drab

A hydrogen getter comprising a thin film having a layer of inert material, and a hydrogen reactive material disposed in or attached to the layer of inert material. The hydrogen reactive material may comprise palladium oxide powder, and the layer of inert material may comprise an epoxy resin. Various forms of the hydrogen reactive material may be used including porous composite, or a solid composite comprising a powder coated organic thin film, for example. An alternative gettering system that is operative in an oxygen environment uses a thin film of hydrogen reactive material that catalyzes the reaction of hydrogen and oxygen to form water. Improved sealed microelectronic packages are also disclosed along with methods of fabricating same.

Hydrogen getters and methods for fabricating sealed microelectronic packages employing same

A method of packaging hybrid wafers or die that are interconnected using soft metal bumps, such as indium, in a sealed ceramic package. The present invention passivates the hybrid die that are to be interconnected by way of the bumps, so that the metal in the bumps (indium) does not wet the surface of the hybrid die when the ceramic package is sealed at high temperature. Vias are formed in the passivated surfaces to expose underlying contact areas. Bumps are then formed on the contact areas, and the bumped and passivated hybrid die are electrically interconnected. The ceramic package containing the electrically interconnected hybrid die is processed at a temperature above the melting temperature of the bumps to attach a ceramic cover to the ceramic package. The method is performed at a temperature well in excess of the melting temperature of the bumps (.about.155.degree. Celsius for indium), typically on the order of 325.degree. Celsius. The surface tension of the indium maintains the bump structure and electrical contact between the two hybrid die. The present invention may also be employed with flip chip and multi-chip module ceramic packages.

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Sherman Oaks, CA, United States of America

Venita L Dyer