Singapore, Singapore

Vanessa Chong Hui Van

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vanessa Chong Hui Van. Retrieved from https://idiyas.com/inventor/vanessa-chong-hui-van

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Vanessa Chong Hui Van: Innovator in Semiconductor Technology

Introduction

Vanessa Chong Hui Van is a prominent inventor based in Singapore, known for her contributions to semiconductor technology. With a focus on innovative packaging solutions, she has made significant strides in the field, earning recognition for her work.

Latest Patents

Vanessa holds 1 patent for her invention titled "Balanced semiconductor device packages including lead frame with floating leads and associated methods." This patent describes a semiconductor device assembly that includes at least one semiconductor device positioned adjacent to floating leads. The assembly may feature multiple semiconductor devices facing opposite directions, with bond pads oriented away from each other. Additionally, the invention includes methods for designing lead frames, assemblies, and packaging techniques.

Career Highlights

Vanessa is currently employed at Micron Technology Incorporated, where she continues to develop cutting-edge semiconductor solutions. Her work has contributed to advancements in the efficiency and functionality of semiconductor devices.

Collaborations

Throughout her career, Vanessa has collaborated with notable colleagues, including Kian Chai Lee and Teck Kheng Lee. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Vanessa Chong Hui Van exemplifies the spirit of innovation in the semiconductor industry. Her contributions through patents and collaborations highlight her commitment to advancing technology and improving device packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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