Apex, NC, United States of America

Van Mieczowski

This inventor holds 1 USPTO granted patent. Top assignee: Cree Gmbh. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Van Mieczowski. Retrieved from https://idiyas.com/inventor/van-mieczowski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Van Mieczowski: Innovator in Semiconductor Processing Technologies

Introduction

Van Mieczowski is a notable inventor based in Apex, NC (US). He has made significant contributions to the field of semiconductor processing through his innovative designs and patents. His work focuses on enhancing the efficiency and effectiveness of vacuum processing systems.

Latest Patents

Van Mieczowski holds a patent for a "Heat sink assembly and related methods for semiconductor vacuum processing systems." This invention features an assembly designed to support a substrate during vacuum processing operations. It includes a thermally conductive heat sink tray with at least one wafer pocket and a heat sink carrier that enhances thermal management during processing.

Career Highlights

Throughout his career, Van has been associated with Cree GmbH, a company known for its advancements in semiconductor technology. His expertise in thermal management solutions has positioned him as a valuable asset in the industry.

Collaborations

Some of his coworkers include Daniel Cronin and Winston T Parker, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Van Mieczowski's contributions to semiconductor processing technologies through his innovative patents and collaborations highlight his role as a key inventor in the industry. His work continues to influence advancements in this critical area of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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