This inventor holds 1 USPTO granted patent. Top assignee: Nortel Networks Corporation. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: Van C Au - Innovator in Electrical Interconnection Technology
Introduction
Van C Au is a notable inventor based in Ottawa, Canada. He has made significant contributions to the field of electrical interconnection technology. His innovative approach has led to the development of a unique patent that enhances the performance of circuit board interconnections.
Latest Patents
Van C Au holds a patent for a "High performance orthogonal interconnect architecture without midplane." This invention provides an improved electrical interconnection between a first circuit board and a second circuit board. In one embodiment, the first circuit board features a substantially rigid circuit portion with multiple circuit layers, including a first signal layer. The design incorporates a flexible portion that allows for a perpendicular orientation of the interconnection, resulting in a substantially orthogonal electrical interconnection arrangement.
Career Highlights
Van C Au is associated with Nortel Networks Corporation, where he has applied his expertise in electrical engineering. His work has contributed to advancements in circuit board technology, showcasing his commitment to innovation in the field.
Collaborations
Throughout his career, Van C Au has collaborated with notable colleagues, including Delfin Y Montuno and Martin Ridgway Handforth. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Van C Au's contributions to electrical interconnection technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, and his work continues to influence the industry.