The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Dec. 20, 2000
Herman Kwong, Kanata, CA;
Bao Chau L. Nguyen, Ottawa, CA;
Van C. Au, Ottawa, CA;
Paul A. Senyshyn, Nepean, CA;
Martin R. Handforth, Kanata, CA;
Rolf G. Meier, Carp, CA;
Delfin Y. Montuno, Kanata, CA;
Ernst A. Munter, Kanata, CA;
Hasler R. Hayes, Munster Hamlet, CA;
Nortel Networks Limited, Quebec, CA;
Abstract
An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.