Vall F McClean

Title: Vall F McClean: Innovator in Under Bump Metallurgy

Introduction

Vall F McClean is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of materials science, particularly in the area of intermetallic diffusion block devices.

Latest Patents

Vall F McClean holds a patent for an "Intermetallic diffusion block device and method of manufacture." This invention focuses on an under bump metallurgy material that includes an adhesion layer, a conduction layer, a barrier layer, and a sacrificial layer. The conduction layer features a trench that contacts a portion of the barrier layer, effectively blocking a path of intermetallic formation between the conduction layer and the sacrificial layer. This innovative approach enhances the reliability and performance of electronic components.

Career Highlights

Vall F McClean is associated with the International Business Machines Corporation (IBM), where he has applied his expertise in materials science to advance technology. His work has contributed to the development of more efficient electronic devices.

Collaborations

Throughout his career, Vall has collaborated with notable colleagues, including Charles Leon Arvin and Carla A Bailey. These partnerships have fostered innovation and have led to advancements in their respective fields.

Conclusion

Vall F McClean's contributions to the field of intermetallic diffusion block devices highlight his role as an innovator in materials science. His patent and work at IBM demonstrate his commitment to advancing technology and improving electronic components.