Valery Kugel

Title: Valery Kugel and Semiconductor Package Innovation.

Introduction

Valery Kugel is an inventor based in Mountain View, California. His patent work includes a semiconductor packaging design intended to reduce package size.

Latest Patents

Kugel is associated with 1 patent: “Semiconductor Package Enabling Reduction in Semiconductor Package Size.” The invention describes a package with a substrate, a semiconductor device on the substrate’s top surface, and a stiffener on its bottom surface. The stiffener may be placed around the perimeter, leaving the central portion available for connection components. Its thickness may be at least as great as the thickness of those components, supporting a compact package configuration.

Career Highlights

Kugel is associated with Hewlett Packard Enterprise Development LP. His patent reflects work on semiconductor packaging, with a focus on reducing package size through the arrangement of structural and connection components.

Collaborations

Omar Ahmed and Peng Su are identified as Kugel’s coworkers. Their shared professional context connects them with the same company, though the provided information does not specify their roles in this patent.

Conclusion

Valery Kugel’s patent presents a semiconductor package design that uses a perimeter stiffener and centrally placed connections to support a smaller package.