The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Feb. 07, 2023
Juniper Networks, Inc., Sunnyvale, CA (US);
Hewlett Packard Enterprise Development LP, Houston, TX (US);
Abstract
A semiconductor package includes a substrate, a semiconductor device, and a stiffener. The substrate has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the substrate. The stiffener is disposed on the bottom surface of the substrate. The stiffener may be disposed on a perimeter portion of the bottom surface of the substrate, and may not be disposed on a central portion of the bottom surface of the substrate. One or more connection components may disposed on the central portion of the bottom surface of the substrate, and a thickness of the stiffener may be greater than or equal to a thickness of the one or more connection components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile