Company Filing History:
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Years Active: 2011-2016
Title: Ute Geissler: Innovator in Bonding Technologies
Introduction
Ute Geissler is a prominent inventor based in Berlin, Germany. She has made significant contributions to the field of bonding technologies, particularly in the development of aluminum alloy wires and ultrasonic wire bonding methods. With a total of 2 patents, her work has garnered attention in both academic and industrial circles.
Latest Patents
Ute Geissler's latest patents include an innovative aluminum alloy wire for bonding applications. This invention relates to a bonding wire that contains a core primarily made of aluminum, with scandium present in an amount between 0.05% and 1.0%. Another notable patent is a method and device for controlling the generation of ultrasonic wire bonds. This method involves pressing a portion of the wire against an electrical contact member while vibrating it to create a bond. The process includes measuring the time-dependent vibration amplitude and deformation of the wire, generating a signal that indicates the stability of the bond.
Career Highlights
Throughout her career, Ute Geissler has worked with notable companies such as Heraeus Deutschland GmbH & Co. KG and Technische Universität Berlin. Her experience in these organizations has allowed her to refine her expertise in bonding technologies and contribute to various research projects.
Collaborations
Ute has collaborated with esteemed colleagues, including Martin Schneider-Ramelow and Eugen Milke. These partnerships have further enhanced her research and development efforts in the field.
Conclusion
Ute Geissler's innovative work in bonding technologies has made her a key figure in her field. Her patents reflect her commitment to advancing technology and improving bonding methods. Her contributions continue to influence both industry practices and academic research.