The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Sep. 04, 2007
Ute Geissler, Berlin, DE;
Herbert Reichl, Berlin, DE;
Holger Gaul, Berlin, DE;
Klaus-dieter Lang, Berlin, DE;
Martin Schneider-ramelow, Berlin, DE;
Ute Geissler, Berlin, DE;
Herbert Reichl, Berlin, DE;
Holger Gaul, Berlin, DE;
Klaus-Dieter Lang, Berlin, DE;
Martin Schneider-Ramelow, Berlin, DE;
Technische Universitaet Berlin, Berlin, DE;
Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V., Munich, DE;
Abstract
A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.