Company Filing History:
1 out of 201 
1 out of 28 
1 out of 4,804 
Years Active: 2011-2016
Title: Martin Schneider-Ramelow: A Pioneer in Bonding Technology
Introduction
Martin Schneider-Ramelow is an innovative inventor based in Berlin, Germany, recognized for his contributions to bonding applications in the field of electrical engineering. With a total of two patents to his name, Schneider-Ramelow has established himself as a key figure in advancing technologies that enhance the reliability and efficiency of electrical connections.
Latest Patents
Schneider-Ramelow's latest patents include a unique aluminum alloy wire specifically designed for bonding applications. This invention features a bonding wire containing a core composed primarily of aluminum and incorporating scandium in a range between 0.05% and 1.0%. This specific alloy composition enhances the performance of the bonding wire in various applications.
Additionally, he has developed a method and device for controlling the generation of ultrasonic wire bonds. This innovative method involves pressing a portion of the wire against an electrical contact member with a specific force while simultaneously vibrating it. This process helps in creating a robust bond, as it allows for the measurement of vibrations and deformations over time to assess the bond's stability.
Career Highlights
Throughout his career, Martin Schneider-Ramelow has worked with leading companies such as Heraeus Deutschland GmbH & Co. KG and Technische Universität Berlin. His roles in these organizations have allowed him to both develop and apply cutting-edge technologies in bonding applications, solidifying his reputation as an expert in this domain.
Collaborations
Schneider-Ramelow has collaborated with notable colleagues, including Ute Geissler and Eugen Milke. Their teamwork has fostered a vibrant exchange of ideas and insights, enriching the development of bonding technologies further and enhancing the impact of their innovations.
Conclusion
Martin Schneider-Ramelow's contributions to the field of bonding technology reflect his dedication to innovation and improvement within electrical engineering. Through his patents and collaborative efforts, he continues to influence the landscape of bonding applications, making significant strides in enhancing electrical connectivity.
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