Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Heraeus Deutschland Gmbh & Co Kg

Technische Universitaet Berlin

Technische Unversität Berlin

Ute Geissler

Martin Schneider-Ramelow

Klaus-Dieter Lang

Eugen Milke

Herbert Reichl

Sven Thomas

Holger Gaul

The invention is related to a bonding wire containing a core having a surface. The core contains aluminum as a main component and scandium in an amount between 0.05% and 1.0%.

Aluminum alloy wire for bonding applications

A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.

Method and device for controlling the generation of ultrasonic wire bonds

Growing community of inventors

Berlin, Germany

Ute Geissler