This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Ursula Meyer - Innovator in Chip Packaging Technology
Introduction
Ursula Meyer is a prominent inventor based in Villach, Austria. She has made significant contributions to the field of chip packaging technology. Her innovative work has led to the development of a unique chip package that enhances the efficiency and functionality of electronic devices.
Latest Patents
Ursula Meyer holds a patent for a chip package and a method for manufacturing it. The patent describes a chip package that includes a first encapsulation structure, a first passivation layer, and an electrically conductive layer. The design features at least one chip arranged over these layers, with contact pads that connect to the conductive layer. Additionally, the package includes cavities that expose portions of the passivation layer, allowing for effective heat management through an inlet and outlet connected to a chamber region.
Career Highlights
Ursula Meyer is associated with Infineon Technologies AG, where she has been instrumental in advancing chip packaging solutions. Her work has not only contributed to the company's portfolio but has also set new standards in the industry. With her innovative approach, she has played a key role in enhancing the performance of electronic components.
Collaborations
Ursula has collaborated with notable colleagues such as Andre Brockmeier and Michael Knabl. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Ursula Meyer is a trailblazer in the field of chip packaging, with her patent showcasing her innovative spirit and technical expertise. Her contributions continue to influence the electronics industry, making her a significant figure in modern technology.