The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Jul. 23, 2012
Carsten Von Koblinski, Bodensdorf, AT;
Michael Knabl, Sattendorf, AT;
Ursula Meyer, Villach-Landskron, AT;
Francisco Javier Santos Rodriguez, Villach, AT;
Alexander Breymesser, Villach, AT;
Andre Brockmeier, Villach, AT;
Carsten Von Koblinski, Bodensdorf, AT;
Michael Knabl, Sattendorf, AT;
Ursula Meyer, Villach-Landskron, AT;
Francisco Javier Santos Rodriguez, Villach, AT;
Alexander Breymesser, Villach, AT;
Andre Brockmeier, Villach, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A chip package is provided, the chip package including: first encapsulation structure; first passivation layer formed over first encapsulation structure and first electrically conductive layer formed over first passivation layer; at least one chip arranged over first electrically conductive layer and passivation layer wherein at least one chip contact pad contacts first electrically conductive layer; at least one cavity formed in first encapsulation structure, wherein at least one cavity exposes a portion of first passivation layer covering at least one chip contact pad; second encapsulation structure disposed over first encapsulation structure and covering at least one cavity, wherein a chamber region over at least one chip contact pad is defined by at least one cavity and second encapsulation structure; wherein second encapsulation structure includes an inlet and outlet connected to chamber region, wherein inlet and outlet control an inflow and outflow of heat dissipating material to and from chamber region.