Urs Rheinegger

Introduction

Urs Rheinegger, a prominent inventor based in Regensdorf, Switzerland, has made significant contributions to the field of material science, particularly in the area of thermal expansion solutions. With a total of eight patents to his name, Rheinegger's work has improved the methods of bonding substrates that exhibit different coefficients of linear thermal expansion.

Latest Patents

Among his latest innovations, Rheinegger has developed a groundbreaking method for structurally joining substrates that possess varying thermal expansion properties. This technique focuses on utilizing a one-component thermosetting epoxy resin composition infused with toughness improvers derived from terminally blocked polyurethane prepolymers. This method is especially relevant in the shell construction of modes of transport and various white goods.

Another notable patent explores the use of toughness improvers to enhance the maximum linear expansion of single-component heat-curing epoxy resin compositions. This approach is pivotal for effectively joining different substrates, addressing the challenges posed by their distinct thermal expansion coefficients, particularly within the frameworks of transportation devices and consumer appliances.

Career Highlights

Rheinegger's career is anchored in his position at Sika Technology AG, a leading manufacturer known for its innovative construction and industrial materials. His expertise and contributions have solidified his reputation as a respected figure in materials engineering, fostering advancements in the bonding processes of diverse substrates.

Collaborations

Throughout his career, Urs Rheinegger has collaborated with other talented professionals, including colleagues Andreas Kramer and Jan Olaf Schulenburg. Their combined efforts have further propelled the development of impactful solutions in the field, showcasing the importance of teamwork in achieving innovative breakthroughs.

Conclusion

Urs Rheinegger continues to push the boundaries of innovation with his inventive solutions for structural joining, particularly in applications requiring unique thermal expansion considerations. His work not only enhances the performance of various materials but also lays the groundwork for further advancements in the industry.