The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Sep. 07, 2018
Applicant:
Sika Technology Ag, Baar, CH;
Inventors:
Andreas Kramer, Zurich, CH;
Jürgen Finter, Zurich, CH;
Karsten Frick, Remetschwil, CH;
Urs Rheinegger, Zurich, CH;
Jan Olaf Schulenburg, Zurich, CH;
Assignee:
SIKA TECHNOLOGY AG, Baar, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/02 (2006.01); C09J 5/06 (2006.01); C09J 5/08 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08G 59/68 (2006.01); C08G 18/79 (2006.01); C08G 18/12 (2006.01); C08G 18/28 (2006.01); C08G 18/48 (2006.01); C08G 18/69 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01); C08L 63/00 (2006.01); C08L 75/04 (2006.01);
U.S. Cl.
CPC ...
C08G 18/792 (2013.01); C08G 18/12 (2013.01); C08G 18/2825 (2013.01); C08G 18/2865 (2013.01); C08G 18/4854 (2013.01); C08G 18/698 (2013.01); C08G 59/686 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01); C08L 63/00 (2013.01); C08L 75/04 (2013.01); C08L 2666/20 (2013.01); Y10T 428/31515 (2015.04);
Abstract
Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.