Bengaluru, India

Unnikrishnan G Pillai

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2019-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Unnikrishnan G Pillai. Retrieved from https://idiyas.com/inventor/unnikrishnan-g-pillai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 40.0

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Bangalore KA, IN (2020)
  • Bengaluru, IN (2019 - 2021)
  • Karnataka, IN (2022)

Company Filing History:


Years Active: 2019-2022

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5 patents (USPTO):Explore Patents

Title: Unnikrishnan G Pillai: Innovator in Thermal Solutions and Wireless Communications

Introduction

Unnikrishnan G Pillai is a notable inventor based in Bengaluru, India, recognized for his significant contributions to the fields of thermal management and wireless communications. With a total of five patents to his name, Pillai continues to push the boundaries of innovation in these critical areas of technology.

Latest Patents

Among his latest patents is a groundbreaking solution for *Thermal Solutions for Package on Package (PoP) Architectures*. This invention outlines advanced electronic packages engineered for enhanced thermal performance. The design comprises a first package substrate with a first die stack atop it, along with a heat spreader that features arms extending beyond the substrate's sidewalls. The innovative approach also includes an interposer that surrounds the heat spreader, ensuring electrical connectivity to the first package substrate via a network of interconnects. Furthermore, there is an additional second package substrate placed above the interposer, hosting a second die, culminating in a more efficient cooling system within electronic devices.

Another notable invention involves *Overhead Communications with Wireless Wearable Devices*. This patent describes a wireless transmission interface apparatus designed to be mounted above a wearable device, which incorporates a first antenna. The configuration establishes a connection between this wearable and a base station with a second antenna, facilitating effective wireless communication. Unnikrishnan's design also allows for at least one antenna to be circular polarized or diversity polarized, enhancing the device's functionality.

Career Highlights

Unnikrishnan G Pillai is currently associated with Intel Corporation, a leading technology company recognized for its cutting-edge innovations. His work at Intel positions him at the forefront of technological advancement, where he applies his expertise in thermal solutions and communication technologies.

Collaborations

Throughout his career, Unnikrishnan has collaborated with prominent colleagues, including Chetan Verma and Bijendra Singh. Together, they have contributed to significant research and development projects that aim to drive the technology industry forward.

Conclusion

Unnikrishnan G Pillai's innovative spirit and dedication to research have led to significant advancements in thermal solutions and wireless communication. With his continued contributions at Intel Corporation, he remains an influential figure in the technology landscape, inspiring future innovations and setting new standards in electronic design and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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