Ui-Hyoung Lee

Title: Ui-Hyoung Lee: Innovator in Solder Joint Structures

Introduction

Ui-Hyoung Lee is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of solder joint structures, particularly through his innovative patent that addresses the challenges associated with metal bumps during soldering processes.

Latest Patents

One of Ui-Hyoung Lee's key patents is titled "Joint structures having organic preservative films." This inventive concept provides methods for inhibiting the formation of one or more oxides on metal bumps during the formation of solder joint structures. The patent includes solder joint structures that feature one or more preservative films. In some embodiments, the solder joint structure consists of a metal bump with a preservative film applied to its surface. This innovation is crucial for enhancing the reliability and performance of electronic components.

Career Highlights

Ui-Hyoung Lee is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to focus on advancing technologies that improve electronic manufacturing processes. His expertise in solder joint structures has positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Ui-Hyoung Lee has collaborated with talented individuals such as Ju-Il Choi and Jeong-Gi Jin. These collaborations have fostered an environment of innovation and have contributed to the development of cutting-edge technologies in the electronics industry.

Conclusion

Ui-Hyoung Lee's contributions to the field of solder joint structures exemplify the importance of innovation in technology. His patent on joint structures with organic preservative films showcases his commitment to enhancing electronic manufacturing processes. His work continues to influence the industry and pave the way for future advancements.