The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Jun. 28, 2012
Applicants:
Ju-il Choi, Suwon-si, KR;
Jeong-gi Jin, Osan-si, KR;
Ui-hyoung Lee, Hwaseong-si, KR;
Hyung-seok Kim, Seoul, KR;
Jeong-woo Park, Suwon-si, KR;
Inventors:
Ju-Il Choi, Suwon-si, KR;
Jeong-Gi Jin, Osan-si, KR;
Ui-Hyoung Lee, Hwaseong-si, KR;
Hyung-Seok Kim, Seoul, KR;
Jeong-Woo Park, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H05K 3/40 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); B23K 1/0016 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); B23K 2201/42 (2013.01); H01L 23/3128 (2013.01); H01L 24/81 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/13566 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13686 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81193 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H05K 3/3489 (2013.01); H05K 3/4007 (2013.01);
Abstract
The inventive concept provides methods for inhibiting the formation of one or more oxides on metal bumps during the formation of solder joint structures and solder joint structures including one or more preservative films. In some embodiments, the solder joint structure includes a metal bump having a preservative film disposed on the surface thereof.