New York, NY, United States of America

Ugur Emekli

This inventor holds 2 USPTO granted patents. Top assignee: Novellus Systems Incorporated. Active years: 2012-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ugur Emekli. Retrieved from https://idiyas.com/inventor/ugur-emekli

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2012-2013

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2 patents (USPTO):Explore Patents

Title: Ugur Emekli: Innovator in Semiconductor Technology

Introduction

Ugur Emekli is a notable inventor based in New York, NY, who has made significant contributions to the semiconductor industry. With a focus on methods for depositing copper on tungsten, his work has led to advancements that reduce costs and complexities in manufacturing processes.

Latest Patents

Ugur Emekli holds 2 patents related to his innovative methods and apparatus for depositing copper on tungsten. These inventions are particularly useful in the semiconductor industry for depositing copper seed layers onto fields or through silicon vias that have tungsten barrier layers. His patents aim to streamline existing methods, making them more efficient and cost-effective.

Career Highlights

Emekli is currently associated with Novellus Systems Incorporated, where he continues to develop and refine technologies that impact the semiconductor manufacturing landscape. His expertise in this field has positioned him as a valuable asset to his company and the industry at large.

Collaborations

Throughout his career, Ugur has collaborated with talented individuals such as Jonathan David Reid and Sesha Varadarajan. These partnerships have fostered innovation and contributed to the success of his projects.

Conclusion

Ugur Emekli's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of manufacturing processes in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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