The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Apr. 02, 2012
Applicants:
Jonathan Reid, Sherwood, OR (US);
Sesha Varadarajan, Lake Oswego, OR (US);
Ugur Emekli, New York, NY (US);
Inventors:
Jonathan Reid, Sherwood, OR (US);
Sesha Varadarajan, Lake Oswego, OR (US);
Ugur Emekli, New York, NY (US);
Assignee:
Novellus Systems, Inc., Fremont, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Apparatus and methods for depositing copper on tungsten are presented. The invention finds particular use in the semiconductor industry for depositing copper seed layers onto fields or through silicon vias having tungsten barrier layers, both reducing cost and complexity of existing methods.