Company Filing History:
7 out of 9,152 
1 out of 40,780 
Years Active: 2020-2025
Title: Tzu-Yang Ting: Innovator in Package Structures and Antenna Modules
Introduction
Tzu-Yang Ting is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the fields of package structures, antenna modules, and probe cards. With a total of 7 patents to his name, Ting's work has had a substantial impact on technology and innovation.
Latest Patents
Ting's latest patents include a package structure, an antenna module, and a probe card. The package structure features a connection member and a first redistribution structure. This connection member consists of a conductive connector surrounded by an insulation layer. The first redistribution structure includes a first dielectric layer, a first wiring pattern, and a first device, all of which are designed to enhance electrical connectivity and performance.
Another notable patent involves a capacitor and filter with a redistribution layer structure. This invention includes multiple electrodes and a dielectric layer, which work together to improve signal integrity and reduce interference. The design allows for effective electrical separation between the ground and signal electrodes, showcasing Ting's innovative approach to electronic component design.
Career Highlights
Throughout his career, Tzu-Yang Ting has worked with esteemed organizations such as the Industrial Technology Research Institute and Taiwan Semiconductor Manufacturing Company. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking advancements in technology.
Collaborations
Ting has collaborated with notable colleagues, including Chieh-Wei Feng and Tzu-Hao Yu. These partnerships have fostered a creative environment that has led to the development of innovative solutions in their respective fields.
Conclusion
Tzu-Yang Ting is a distinguished inventor whose work in package structures and antenna modules has significantly advanced technology. His contributions, reflected in his patents, demonstrate his commitment to innovation and excellence in engineering.