Tzu-Ting Liu

Title: Tzu-Ting Liu: Semiconductor Invention and Patent

Introduction

Tzu-Ting Liu is an inventor associated with Taoyuan City, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work concerns semiconductor interconnect structures and the integration of a metal-insulator-metal capacitor into a passivation layer.

Latest Patents

Liu is named on 1 patent: “Embedding a Metal-Insulator-Metal Capacitor in a Passivation Layer.” The invention describes forming a passivation layer over an interconnect structure and etching an opening into it. A first conductive layer and an insulator layer are deposited so that each partially fills the opening, followed by a second conductive layer that completely fills it. Separate conductive structures connect electrically to the first and second conductive layers. This arrangement provides a method for embedding a metal-insulator-metal capacitor within the passivation layer.

Career Highlights

Liu’s listed patent reflects work on semiconductor device fabrication, particularly capacitor integration within an interconnect structure. His association with Taiwan Semiconductor Manufacturing Company Limited places this work in the context of advanced semiconductor manufacturing.

Collaborations

Liu’s listed coworker is Ying-Ju Wu. The patent information provided identifies both inventors in connection with the capacitor-integration technology.

Conclusion

Tzu-Ting Liu’s patent documents a semiconductor fabrication approach for embedding a metal-insulator-metal capacitor in a passivation layer, highlighting his contribution to device integration.