Taichung, Taiwan

Tzu Hsien Yu

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzu Hsien Yu. Retrieved from https://idiyas.com/inventor/tzu-hsien-yu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tzu Hsien Yu: Microelectronic Component Characterization

Introduction

Tzu Hsien Yu is an inventor associated with Taichung, Taiwan, and Micron Technology Incorporated. His listed patent work concerns methods for characterizing microelectronic components and optionally sorting and assembling them according to warpage.

Latest Patents

Yu is credited with 1 patent: “Apparatus and Method for Characterization and Optional Sorting and Assembly of Microelectronic Components According to Warpage.” The invention addresses evaluating component warpage and using that characterization to guide sorting and assembly.

Career Highlights

Yu’s listed work connects his inventive activity with Micron Technology Incorporated and the development of processes for handling microelectronic components. The patent focuses on warpage as a factor in component characterization and manufacturing decisions.

Collaborations

Deepti Verma is listed as Yu’s coworker. Their shared professional association is connected to Micron Technology Incorporated.

Conclusion

Tzu Hsien Yu’s recorded patent highlights an approach to characterizing microelectronic components by warpage, with potential applications in sorting and assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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