Taoyuan, Taiwan

Tzong-Daw Wu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Institute of Nuclear Energy Research. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzong-Daw Wu. Retrieved from https://idiyas.com/inventor/tzong-daw-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Tzong-Daw Wu and Thin-Film Measurement Innovation.

Introduction

Tzong-Daw Wu is an inventor associated with Taoyuan, Taiwan, and the Institute of Nuclear Energy Research. His patent work includes a method and system for measuring the thickness of thin films using artificial neural networks and spectral data.

Latest Patents

Wu is named on 1 patent: “Method and System for Measuring Thickness of Thin Film.” The invention uses a training database containing modified spectra paired with corresponding film thicknesses to train an artificial neural network. A spectrum measured from a coated sample is then processed by the trained network to estimate the film’s thickness. The related system includes a measuring unit, a spectrometer, and a processing unit.

Career Highlights

Wu’s documented patent contribution applies machine learning to thin-film measurement, using spectral analysis to estimate coating thickness. His work is associated with the Institute of Nuclear Energy Research.

Collaborations

Wu’s listed coworkers include Cheng-Chang Hsieh and Jiun-Shen Chen.

Conclusion

Tzong-Daw Wu’s patent describes an artificial-neural-network approach to estimating thin-film thickness from measured spectra, connecting his work at the Institute of Nuclear Energy Research with a practical measurement innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…