Company Filing History:
Years Active: 2015
Title: Tze Wei Dennis Chew: Innovator in Micro-Sensor Technology
Introduction
Tze Wei Dennis Chew is a notable inventor based in Singapore, recognized for his contributions to micro-sensor technology. He holds a patent that showcases his innovative approach to enhancing the functionality and reliability of micro-sensor devices.
Latest Patents
His patent, titled "Adhesive bonding technique for use with capacitive micro-sensors," describes a micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap. This design provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. The method of fabricating the micro-sensor device involves bonding the patterned cap to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same as that used for the dielectric active elements, such as a photo-sensitive polyimide film. Tze Wei Dennis Chew holds 1 patent.
Career Highlights
Tze Wei Dennis Chew is currently employed at STMicroelectronics GmbH, where he continues to work on advancing micro-sensor technologies. His role involves collaborating with other experts in the field to develop innovative solutions that meet the demands of modern applications.
Collaborations
Some of his coworkers include Olivier Le Neel and Shian-Yeu Kam, who contribute to the collaborative environment at STMicroelectronics GmbH.
Conclusion
Tze Wei Dennis Chew's work in micro-sensor technology exemplifies the innovative spirit of modern inventors. His contributions are paving the way for advancements in sensor applications, showcasing the importance of research and development in this field.