The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Mar. 29, 2013
Applicant:

Stmicroelectronics Pte Ltd., Singapore, SG;

Inventors:

Olivier Le Neel, Singapore, SG;

Shian-Yeu Kam, Singapore, SG;

Tien-Choy Loh, Singapore, SG;

Ditto Adnan, Singapore, SG;

Tze Wei Dennis Chew, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); G01N 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/561 (2013.01); H01L 25/00 (2013.01); G01N 27/223 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.


Find Patent Forward Citations

Loading…