Neenah, WI, United States of America

Tyler J Theobald

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: The Innovations of Tyler J Theobald

Introduction

Tyler J Theobald is an accomplished inventor based in Neenah, WI (US). He holds a patent that showcases his innovative approach to packaging technology. His work focuses on enhancing the efficiency and effectiveness of packaging processes, particularly for hard food items.

Latest Patents

Tyler's notable patent is titled "Pattern laminated double wall plastic web from heat shrinkable and non-heat shrinkable films." This invention addresses the need for improved puncture resistance in semi-automatic horizontal form fill and seal (HFFS) packaging machines. The patent describes a process for packaging hard food items with sharp angular surfaces using webs that feature a double wall partially laminated structure. The unique design involves adhesively laminating two component films in a face-to-face configuration, allowing for optimal performance during the packaging process.

Career Highlights

Throughout his career, Tyler has worked with prominent companies in the packaging industry, including Bemis Company, Inc. and Amcor Flexibles North America, Inc. His experience in these organizations has contributed significantly to his expertise in packaging solutions and innovations.

Collaborations

Tyler has collaborated with talented individuals such as Tara Kay Cruz and Michael J Douglas. These partnerships have likely enriched his work and contributed to the development of his innovative ideas.

Conclusion

Tyler J Theobald is a notable inventor whose contributions to packaging technology have made a significant impact. His patent reflects his commitment to improving the efficiency and effectiveness of packaging processes.

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