Company Filing History:
Years Active: 2014-2016
Title: Innovations by Tunglok Li in Integrated Circuit Packaging
Introduction
Tunglok Li is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit (IC) packaging. With a total of 2 patents to his name, his work focuses on enhancing the efficiency and functionality of IC packages.
Latest Patents
Tunglok Li's latest patents include innovative designs and methods for manufacturing IC packages. One of his patents describes an IC package that comprises a leadframe made of a metal strip, which is partially etched on one side. This leadframe is designed to accommodate an IC chip and features multiple bonding areas that are electrically connected to both the leadframe and the IC chip. The encapsulation compound covers the IC chip, bonding areas, and a portion of the metal leadframe, with contact pads protruding from the bottom surface. Additionally, the manufacturing process allows for the bottom surface of the leadframe to be etched multiple times to reduce undercutting. Another patent focuses on a leadframe for IC packages, which can be selectively plated on either side and is configured for electrical connections with the IC chip.
Career Highlights
Tunglok Li is currently associated with Kaixin, Inc., where he continues to innovate in the field of IC packaging. His work has been instrumental in advancing the technology used in electronic devices, making them more efficient and reliable.
Conclusion
Tunglok Li's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in IC design and manufacturing. Through his work, he continues to influence the future of electronic technology.