The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Nov. 26, 2009
Tunglok LI, Hong Kong, CN;
Tunglok Li, Hong Kong, CN;
Kaixin, Inc., Tseun Wan, CN;
Abstract
An IC package is provided. The IC package comprises a leadframe comprising a metal strip () partially etched on a first side. The leadframe may be configured for an IC chip to be mounted thereon and for a plurality of bonding areas () to be electrically coupled to the leadframe and the IC chip. The IC chip, the bonding areas, and a portion of the metal leadframe are covered with an encapsulation compound, with a plurality of contact pads () protruding from the bottom surface of the leadframe. The bottom surface of the leadframe may be etched one or more times during the manufacturing process to reduce the depth of the undercutting. A method for manufacturing an IC package is also provided.