Kaixin, Inc.

Tunglok Li

An IC package is provided. The IC package comprises a leadframe comprising a metal strip () partially etched on a first side. The leadframe may be configured for an IC chip to be mounted thereon and for a plurality of bonding areas () to be electrically coupled to the leadframe and the IC chip. The IC chip, the bonding areas, and a portion of the metal leadframe are covered with an encapsulation compound, with a plurality of contact pads () protruding from the bottom surface of the leadframe. The bottom surface of the leadframe may be etched one or more times during the manufacturing process to reduce the depth of the undercutting. A method for manufacturing an IC package is also provided.

IC package and method for manufacturing the same

A leadframe for use in an integrated circuit (IC) package comprising a metal strip partially etched on a first side. In some embodiments, the leadframe may be selectively plated on the first side and/or on a second side. The leadframe may be configured for an IC chip to be mounted thereon and for a plurality of electrical contacts to be electrically coupled to the leadframe and the IC chip.

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Hong Kong, China

Tunglok Li