This inventor holds 1 USPTO granted patent. Top assignee: Oriental System Technology Inc.. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Tung Yang Lee and His Thermal Sensor Package for Earbuds.
Introduction
Tung Yang Lee is an inventor based in Zhubei, Taiwan. His work includes a patent for a thermal sensor package designed for earbuds.
Latest Patents
Lee’s listed patent, “Thermal Sensor Package for Earbuds,” describes a package with two thermopile sensor elements on a single chip. A block wall in the cap separates the elements. One senses external infrared radiation through a cap window, while the other senses infrared radiation from inside the package to help correct measurement errors caused by the package structure. This compensation can improve measurement accuracy. The design also uses a simple packaging process and can accommodate a silicon-based infrared lens, allowing for broader applications. Lee is listed with 1 patent.
Career Highlights
Lee is associated with Oriental System Technology Inc. His patented work focuses on improving thermal sensing accuracy in earbud applications.
Collaborations
Lee’s listed coworkers include Chein-Hsun Wang and Yu-Chih Liang.
Conclusion
Tung Yang Lee’s patent presents a compact approach to correcting package-related measurement errors in earbud thermal sensors, with a design intended to support accurate sensing and flexible integration.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile