The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Jun. 14, 2019
Applicant:

Oriental System Technology Inc., Hsinchu, TW;

Inventors:

Chein-Hsun Wang, Hsin-Chu, TW;

Ming Le, New Taipei, TW;

Yu-Chih Liang, Hsinchu, TW;

Tung Yang Lee, Zhubei, TW;

Chih-Yung Tsai, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/01 (2006.01); G01K 13/20 (2021.01); A61B 5/00 (2006.01); H04R 1/10 (2006.01);
U.S. Cl.
CPC ...
G01K 13/223 (2021.01); A61B 5/01 (2013.01); A61B 5/6803 (2013.01); H04R 1/1016 (2013.01); H04R 1/1058 (2013.01); A61B 5/6817 (2013.01); A61B 2560/0252 (2013.01); A61B 2562/185 (2013.01); H04R 2420/07 (2013.01);
Abstract

A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.


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