Tung-Hung Hsieh

Title: Tung-Hung Hsieh: Innovator in Semiconductor Technology

Introduction

Tung-Hung Hsieh is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to device design.

Latest Patents

Hsieh's latest patents focus on a package structure and methods of forming semiconductor devices. One of his notable inventions includes a semiconductor device that features a first die with an active surface and a backside surface, along with a second die. The first active surface of the first die is electrically coupled to an interposer, while the second active surface of the second die is connected to another side of the interposer. This design also incorporates a first connector over the interposer and an encapsulating material that surrounds the second die, ensuring efficient electrical coupling through a via that is coplanar with the encapsulating material's surface.

Career Highlights

Hsieh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor devices, contributing to the company's reputation for innovation and excellence.

Collaborations

Throughout his career, Hsieh has collaborated with notable colleagues, including Bruce C. S. Chou and Chih-Hsien Lin. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Tung-Hung Hsieh is a key figure in the semiconductor industry, with a focus on innovative package structures and methods. His contributions continue to shape the future of semiconductor technology, making him a valuable asset to his company and the field at large.