Taiwan Semiconductor Manufacturing Comp. Ltd.

Tung-Hung Hsieh

Bruce C S Chou

Chih-Hsien Lin

Chen-Hua Lin

Jung-Kuo Tu

Hsiang-Tai Lu

Mingo Liu

A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material.

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Hsin-Chu, Taiwan

Tung-Hung Hsieh