Company Filing History:
Years Active: 2016-2023
Title: **Tsuyoshi Tadano: Innovator in Wafer Dicing Technology**
Introduction
Tsuyoshi Tadano, an accomplished inventor based in Tokyo, Japan, has made significant contributions to the field of wafer processing technology. With a total of three patents to his name, Tadano is recognized for his innovative solutions that enhance the efficiency and reliability of semiconductor manufacturing processes.
Latest Patents
Tadano's latest patent innovations include:
1. **Formulation and Processing Solution for Dicing Process**: This formulation for a wafer dicing process consists of a carefully balanced mixture that includes 1.0 to 1.5 mass % of a partially saponified polyvinyl alcohol, 0.4 to 0.6 mass % of a polyoxyethylene-polyoxypropylene glycol ether, and pure water. The resulting processing solution, diluted significantly with pure water, is designed to effectively remove dicing offcuts and adhesive residues during the dicing operation.
2. **Protective Film Material for Laser Processing and Wafer Processing Method Using the Protective Film Material**: This patent involves a protective film material comprised of a water-soluble adhesive and a water-soluble laser beam absorbent, adjusted to optimize absorbance at a specific wavelength. This innovative protective film is designed to absorb laser energy effectively, minimizing debris generation and ensuring clean removal post-processing.
Career Highlights
Tsuyoshi Tadano works at Nikka Seiko Co., Ltd., a company dedicated to advancing technology in the semiconductor field. His expertise in wafer processing has positioned him as a key contributor to innovative methods that improve production efficiency and yield.
Collaborations
Throughout his career, Tadano has collaborated with skilled professionals such as Masafumi Hirose and Masaaki Shinjo. These collaborations have fostered an environment of creativity and innovation, leading to groundbreaking advancements in the industry.
Conclusion
Tsuyoshi Tadano's work exemplifies the spirit of innovation in the semiconductor sector. With his patents focusing on wafer processing improvements, he continues to influence the future of technology within the industry. His contributions not only enhance production methods but also pave the way for further advancements in semiconductor manufacturing.